Hiksemi Future HSC532U64C5-16G-2 Memory Module 32GB DDR5 6400MHz

Hiksemi Future HSC532U64C5-16G-2 Memory Module 32GB DDR5 6400MHz

Key Features:

• 32GB total memory capacity supplied as 2 x 16GB modules
• High-speed DDR5 memory operating at 6400MHz
• 288-pin UDIMM format for compatible desktop computers
• Dual-module kit ideal for supported dual-channel configurations
• Integrated heatsinks assist with thermal management
• Customisable RGB lighting for gaming and enthusiast PC builds
• Supports Intel XMP 3.0 for simplified memory overclocking
• Carefully selected memory ICs for stable performance
• Designed for gaming, content creation and demanding multitasking
• Limited lifetime manufacturer warranty

The HIKSEMI Future HSC532U64C5-16G-2 is a high-performance 32GB DDR5 desktop memory kit consisting of two matched 16GB modules. Operating at 6400MHz, it provides the bandwidth required for modern gaming systems, creative applications and demanding multitasking while adding integrated RGB lighting to compatible desktop builds.

Features

32GB Dual-Module DDR5 Kit

The kit provides a total capacity of 32GB through two 16GB UDIMM modules. Installing the matching modules in a supported motherboard configuration enables users to take advantage of the platform's available multi-channel memory architecture.

High-Speed 6400MHz Performance

DDR5 technology provides increased bandwidth compared with previous-generation DDR4 memory. The 6400MHz operating frequency is designed for modern high-performance desktop platforms where fast memory throughput can benefit gaming, content creation and productivity workloads.

Intel XMP 3.0 Support

HIKSEMI's FUTURE DDR5 series supports Intel XMP 3.0, allowing compatible motherboards and processors to apply supported high-performance memory profiles through the system BIOS without requiring every setting to be configured manually.

RGB Gaming Design

Integrated RGB lighting gives the FUTURE series a distinctive appearance inside windowed gaming systems. The lighting is built into the module's heatspreader design to combine system aesthetics with thermal management.

Selected ICs & Stable Operation

HIKSEMI uses carefully selected memory ICs for the FUTURE series to help provide reliable operation and consistent performance under demanding workloads and supported overclocked configurations.

288-Pin Desktop UDIMM

The modules use the standard 288-pin DDR5 UDIMM form factor for compatible desktop motherboards. A DDR5-compatible motherboard and processor are required; DDR5 modules cannot be installed in DDR4 memory slots.

• This kit contains two 16GB modules for a combined capacity of 32GB.
• Maximum memory speed depends on processor, motherboard, BIOS and memory-controller support.
• Intel XMP operation may require manual activation in the motherboard BIOS.
• DDR5 memory is not physically compatible with DDR4 memory slots.

Technical Specifications:

Choose the HIKSEMI Future HSC532U64C5-16G-2 for a high-performance 32GB DDR5 upgrade combining 6400MHz memory speed, a matched 2 x 16GB configuration, Intel XMP 3.0 support, integrated heatspreaders and RGB lighting for modern desktop and gaming systems.