Cooler Master Thermal Pad Pro Heat Sink Compound TPY-NDPB-9020-R1

Cooler Master Thermal Pad Pro Heat Sink Compound TPY-NDPB-9020-R1

THERMAL PAD PRO

Cooler Master’s new Thermal Pad Pro is an innovative solution to device cooling for a vast range of your electronic devices and components.

FORMULATED WITH NANO DIAMOND PARTICLES

15.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.

NON-TOXIC AND NON-CORROSIVE

Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.

DOUBLE-SIDED ADHESIVE

Provides seamless and secure contact between surfaces.

WIDE RANGE OF APPLICATION

Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.

VERSATILE AND EASY APPLICATION

Easily cut to the perfect size for your application. Choices of 1mm and 2mm thickness are available.

Features:

• Formulated with Nano Diamond Particles
• Non-toxic and Non-corrosive
• Double-sided Adhesive
• Versatile and Easy Application

Specifications

Product: Cooler Master Thermal Pad Pro

Type: Thermal pad

Thermal conductivity: 15.3 W/m·K

Density: 3.4 g/cm³

Width: 45 mm

Depth: 95 mm

Height: 2 mm

Quantity per pack: 1 pc(s)

Package width: 170 mm

Package depth: 82 mm

Master (outer) case width: 200 mm

Master (outer) case length: 320 mm

Master (outer) case height: 195 mm