Transcend MTE480T M.2 512GB PCIe 4.0 NVMe Internal SSD TS512GMTE480T
Transcend MTE480T M.2 512GB PCIe 4.0 NVMe Internal SSD TS512GMTE480T is backordered and will ship as soon as it is back in stock.
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Description
Description
Transcend MTE480T M.2 512GB PCIe 4.0 NVMe Internal SSD TS512GMTE480T
Transcend's M.2 SSD MTE480T is a self-encrypting drive (SED) that complies with the TCG Opal 2.0 standards. Data is protected using the hardware-based AES 256-bit encryption and LBA (Logical Block Address)sector-specific permissions.
Transecnd's MTE480T features the 112-layer 3D NAND flash, a high-speed PCI Express (PCIe) Gen4 x4 interface, and a powerful controller, achieving never-before-seen transfer speeds. In addition, the 30µ" gold finger PCB, Corner Bond technology, and anti-sulfur resistors guarantee its reliability in harsh conditions. Transcend's MTE480T is also 100% chamber tested in-house for extended operating temperatures of -20℃~75℃.
Transcend also offers the MTE480T-I with wide temperature (-40℃~ 85℃) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications.
Firmware Features
- Supports NVM command
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
- Full drive encryption with Advanced Encryption Standard (AES)
- Compliant with TCG Opal specifications and IEEE 1667 standards
- Power-saving DevSleep (Device Sleep) mode (optional)
Hardware Features
- Compliant with NVM Express specification 1.4
- Compliant with PCI Express specification 4.0
- Space-saving M.2 form factor (42mm) – ideal for mobile computing devices
- PCIe Gen 4 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
Specifications
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