Description
Gigabyte GV-R57XTGAMING-OC-8GD. Graphics processor family: AMD, Graphics processor: Radeon RX 5700 XT, Processor frequency: 1650 MHz. Discrete graphics adapter memory: 8 GB, Graphics adapter memory type: GDDR6, Memory bus: 256 bit, Memory clock speed: 14000 MHz. Maximum resolution: 7680 x 4320 pixels. DirectX version: 12.0, OpenGL version: 4.6. Interface type: PCI Express x16 3.0. Cooling type: Active, Number of fans: 3 fan(s), Illumination colour: Multi
WINDFORCE 3X COOLING SYSTEM
The WINDFORCE 3X cooling system features 3x 80mm unique blade fans, alternate spinning fan, 5 composite copper heat pipes, heat-pipe direct touch and 3D active fan functionality, together delivering an effective heat dissipation capacity for higher performance at lower temperatures.
ALTERNATE SPINNING
The GIGABYTE “Alternate Spinning” is the only solution that can solve the turbulent airflow of three fans. The biggest problem with the three fans is turbulence. Since the fans rotate in the same direction, the airflow direction is opposite between the fans, which will cause turbulent airflow and reduce heat dissipation efficiency. GIGABYTE turns the middle fan in the opposite direction, so that the airflow direction between the two fans is the same, reducing the turbulence and enhancing the airflow pressure.
UNIQUE BLADE FAN
The airflow is spilt by the triangular fan edge, and guided smoothly through the 3D stripe curve on the fan surface, effectively enhancing the airflow.
3D ACTIVE FAN
The 3D Active Fan provides semi-passive cooling, and the fans will remain off when the GPU is in a low load or low power game. It allows gamers to enjoy gameplay in complete silence when the system is running light or idle.
HEAT PIPES DIRECT TOUCH GPU
The shape of the pure copper heat pipes maximize the direct contact area with the GPU, enhancing heat transfer. The heat pipes also cover the VRAM through a large metal plate contact to ensure proper cooling.
COMPOSITE HEAT-PIPE
The composite heat-pipe combines thermal conductivity and phase transition to efficiently manage the heat transfer between two solid interfaces which increases cooling capacity.
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