Description
Cooler Master 1mm Heat Sink Thermal Compound Pad Pro Blue
Cooling Versatility Everywhere Thermal Pad Pro
Cooler Master's new Thermal Pad Pro is an innovative solution to device cooling for a vast range of your electronic devices and components.
Formulated with Nano Diamond Particles
15.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.
Non-toxic and Non-corrosive
Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.
Double-sided Adhesive
Provides seamless and secure contact between surfaces.
Wide Range of Application
Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.
Versatile and Easy Application
Easily cut to the perfect size for your application. Choices of 1mm and 2mm thickness are available.
Technical Specification
Product: Cooler Master Thermal Pad Pro. Type: Thermal pad, Thermal conductivity: 15.3 W/m·K, Density: 3.4 g/cm³. Width: 45 mm, Depth: 95 mm, Height: 1 mm. Quantity per pack: 1 pc(s), Package width: 170 mm, Package depth: 82 mm. Master (outer) case width: 200 mm, Master (outer) case length: 320 mm, Master (outer) case height: 192 mm